Server-Grade Skived Copper Heat Sink for Workstation Processors
Product Details
| Customization: | Available |
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| Condition: | New |
| Certification: | CE, RoHS, GS, ISO9001 |
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-Implementing a digitalization process
-Developing a technical transformation plan
-Real-time monitoring of big data
-Utilizing an ERP system for digital management
-Employing an OA system to streamline processes
-Implementing a CRM system for customer relationship management
-Adopting a SAP system for internal financial management
-Utilizing an AI model for processing big data and enabling decision-making
The supplier has a complete and standardized quality control process, check the Audit Report for more information
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Basic Info.
- Model NO.
- Shovel Heat Sink
- Standard
- DIN, ASTM, GOST, GB, JIS, ANSI, BS
- Customized
- Customized
- Material
- Aluminum
- Product Name
- Shovel Heat Sink
- Keywords
- Aluminum Shovel-Tooth Heat Sink
- Length
- 50.0 ± 0.2mm
- Width
- 25.0 ± 0.2mm
- Height
- 38.0 ± 0.3mm
- Weight
- 45 ± 3G
- Thermal Conductivity
- 205W/M·K
- Thermal Resistance
- 2.5°C/W
- Maximum Power Dissipation
- 25W
- Base Material
- 6063-T5 Aluminum Alloy
- Surface Treatment
- Anodized Finish
- Transport Package
- Standard Packaging or Customized
- Specification
- Standard Specifications or Customized
- Trademark
- DY
- Origin
- Shijiazhuang, China
- Production Capacity
- 50000pieces/Year
Packaging & Delivery
- Package Size
- 10.00cm * 15.00cm * 5.00cm
- Package Gross Weight
- 0.500kg
Product Description

Product Description

SHOVEL HEAT SINK
High-Performance Aluminum Shovel Heat Sink designed for optimal thermal dissipation and cooling efficiency.
High-Performance Aluminum Shovel Heat Sink designed for optimal thermal dissipation and cooling efficiency.
This lightweight heat sink features a distinctive shovel-shaped profile that maximizes surface area while maintaining compact dimensions for space-constrained applications.
KEY FEATURES & BENEFITS:
Superior Heat Transfer Performance - The innovative fin design and enhanced surface area provide exceptional thermal conductivity (typically 200+ W/mK), ensuring rapid heat dissipation from CPUs, LEDs, power electronics, and semiconductor devices.
Precision Engineering - Manufactured from high-grade 6063 aluminum alloy with anodized surface treatment for enhanced corrosion resistance and durability. The machined base ensures perfect thermal interface contact.
Versatile Mounting Options - Compatible with standard thermal adhesive, thermal tape, or mechanical fastening systems. Suitable for
Superior Heat Transfer Performance - The innovative fin design and enhanced surface area provide exceptional thermal conductivity (typically 200+ W/mK), ensuring rapid heat dissipation from CPUs, LEDs, power electronics, and semiconductor devices.
Precision Engineering - Manufactured from high-grade 6063 aluminum alloy with anodized surface treatment for enhanced corrosion resistance and durability. The machined base ensures perfect thermal interface contact.
Versatile Mounting Options - Compatible with standard thermal adhesive, thermal tape, or mechanical fastening systems. Suitable for
Specification
TECHNICAL PARAMETERS | |
Product Name | Shovel Heat Sink |
Keywords | Aluminum Shovel-Tooth Heat Sink |
Length | 50.0 ± 0.2mm |
Width | 25.0 ± 0.2mm |
Height | 38.0 ± 0.3mm |
Weight | 45 ± 3g |
Thermal Conductivity | 205W/m·K |
Thermal Resistance | 2.5°C/W |
Maximum Power Dissipation | 25W |
Base Material | 6063-T5 Aluminum Alloy |
Surface Treatment | Anodized Finish |
Detailed Photos
ADVANCED DIRECTIONAL HEAT FLOW DESIGN
Unique shovel geometry optimizes heat channeling from source to ambient air, delivering 30% faster heat dissipation compared to traditional flat heat sinks through engineered airflow patterns.
UNIVERSAL COMPATIBILITY & QUICK INTEGRATION
Standard footprint design fits 90% of common electronic packages, including TO-220, TO-247, and custom PCB layouts. Tool-free mounting with pre-applied thermal interface reduces installation time by 75%.
EXTENDED COMPONENT LIFESPAN PROTECTION
Maintains junction temperatures below critical thresholds, extending component lifespan up to 3x longer. Prevents thermal cycling damage and performance degradation in mission-critical applications.
SPACE-OPTIMIZED COMPACT FORM FACTOR
Vertical heat channeling design achieves maximum cooling capacity in minimal PCB real estate. Low-profile construction enables dense component placement without compromising thermal performance.






FAQ
Q1: Are you a factory or a trader?
A: We are a manufacturer integrating industry and trade. Welcome to visit our company.
Q2: Can I add my LOGO to the product?
A: We support on-demand customization, including LOGO customization, color customization, appearance size customization, etc.
Q3: What payment methods do you support?
A: We support T/T, Western Union, PayPal, cash, etc. The details can be negotiated.
Q4: What are your modes of transportation?
A: We usually choose the appropriate mode of transportation (sea, air, land) according to the conditions of the goods, or we can choose the mode of transportation according to your requirements.
Q5: How can I get an accurate quotation?
A: You can first send your specific demand information and product pictures, and we will customize a solution for you according to your needs and inform you of the specific price.
Q2: Can I add my LOGO to the product?
A: We support on-demand customization, including LOGO customization, color customization, appearance size customization, etc.
Q3: What payment methods do you support?
A: We support T/T, Western Union, PayPal, cash, etc. The details can be negotiated.
Q4: What are your modes of transportation?
A: We usually choose the appropriate mode of transportation (sea, air, land) according to the conditions of the goods, or we can choose the mode of transportation according to your requirements.
Q5: How can I get an accurate quotation?
A: You can first send your specific demand information and product pictures, and we will customize a solution for you according to your needs and inform you of the specific price.
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