High Quality Skiving Fin Heat Sink for Data Center Cooling System

• Customization: Available
• Condition: New
• Certification: CE, RoHS, GS, ISO9001
• Model NO.: Shovel Heat Sink
• Standard: DIN, ASTM, GOST, GB, JIS, ANSI, BS
• Customized: Customized
• Material: Aluminum
• Product Name: Shovel Heat Sink
• Keywords: Aluminum Shovel-Tooth Heat Sink
• Length: 50.0 ± 0.2mm
• Width: 25.0 ± 0.2mm
• Height: 38.0 ± 0.3mm
• Weight: 45 ± 3G
• Thermal Conductivity: 205W/M·K
• Thermal Resistance: 2.5°C/W
• Maximum Power Dissipation: 25W
• Base Material: 6063-T5 Aluminum Alloy
• Surface Treatment: Anodized Finish
• Transport Package: Standard Packaging or Customized
• Specification: Standard Specifications or Customized
• Trademark: DY
• Origin: Shijiazhuang, China
• Production Capacity: 50000pieces/Year
• Package Size: 20.00cm * 15.00cm * 10.00cm
• Package Gross Weight: 0.500kg

Product Description

Product Description

SHOVEL HEAT SINK
 
High-Performance Aluminum Shovel Heat Sink designed for optimal thermal dissipation and cooling efficiency.

This lightweight heat sink features a distinctive shovel-shaped profile that maximizes surface area while maintaining compact dimensions for space-constrained applications.

KEY FEATURES & BENEFITS:
 
Superior Heat Transfer Performance - The innovative fin design and enhanced surface area provide exceptional thermal conductivity (typically 200+ W/mK), ensuring rapid heat dissipation from CPUs, LEDs, power electronics, and semiconductor devices.
 
Precision Engineering - Manufactured from high-grade 6063 aluminum alloy with anodized surface treatment for enhanced corrosion resistance and durability. The machined base ensures perfect thermal interface contact.
 
Versatile Mounting Options - Compatible with standard thermal adhesive, thermal tape, or mechanical fastening systems. Suitable for

Specification

TECHNICAL PARAMETERS
Product Name	Shovel Heat Sink
Keywords	Aluminum Shovel-Tooth Heat Sink
Length	50.0 ± 0.2mm
Width	25.0 ± 0.2mm
Height	38.0 ± 0.3mm
Weight	45 ± 3g
Thermal Conductivity	205W/m·K
Thermal Resistance	2.5°C/W
Maximum Power Dissipation	25W
Base Material	6063-T5 Aluminum Alloy
Surface Treatment	Anodized Finish

Detailed Photos

ADVANCED DIRECTIONAL HEAT FLOW DESIGN 

Unique shovel geometry optimizes heat channeling from source to ambient air, delivering 30% faster heat dissipation compared to traditional flat heat sinks through engineered airflow patterns.
 
UNIVERSAL COMPATIBILITY & QUICK INTEGRATION 

Standard footprint design fits 90% of common electronic packages, including TO-220, TO-247, and custom PCB layouts. Tool-free mounting with pre-applied thermal interface reduces installation time by 75%.
 
EXTENDED COMPONENT LIFESPAN PROTECTION 

Maintains junction temperatures below critical thresholds, extending component lifespan up to 3x longer. Prevents thermal cycling damage and performance degradation in mission-critical applications.
 
SPACE-OPTIMIZED COMPACT FORM FACTOR

Vertical heat channeling design achieves maximum cooling capacity in minimal PCB real estate. Low-profile construction enables dense component placement without compromising thermal performance.

FAQ

Q1: Are you a factory or a trader?

A: We are a manufacturer integrating industry and trade. Welcome to visit our company.
 
Q2: Can I add my LOGO to the product?
A: We support on-demand customization, including LOGO customization, color customization, appearance size customization, etc.
 
Q3: What payment methods do you support?
A: We support T/T, Western Union, PayPal, cash, etc. The details can be negotiated.
 
Q4: What are your modes of transportation?
A: We usually choose the appropriate mode of transportation (sea, air, land) according to the conditions of the goods, or we can choose the mode of transportation according to your requirements.
 
Q5: How can I get an accurate quotation?
A: You can first send your specific demand information and product pictures, and we will customize a solution for you according to your needs and inform you of the specific price.